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參數(shù)資料
型號: AD8016ARB-REEL
廠商: ANALOG DEVICES INC
元件分類: 運動控制電子
英文描述: Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No
中文描述: DUAL OP-AMP, 3000 uV OFFSET-MAX, PDSO24
封裝: BATWING, SOIC-24
文件頁數(shù): 15/20頁
文件大小: 569K
代理商: AD8016ARB-REEL
REV. A
AD8016
–15–
EXPERIMENTAL RESULTS
The experimental data suggests that for both packages, and a
PCB as small as 4.7 square inches, reasonable junction tempera-
tures can be maintained even in the absence of air flow. The graph
in Figure 42 shows junction temperature versus air flow for various
dimensions of 1 ounce copper PCBs at an ambient temperature
of 24
°
C in both the ARB and ARP packages. For the worst case
package, the AD8016ARB and the worst case PCB at 4.7 square
inches, the extrapolated junction temperature for an ambient
environment of 85
°
C would be approximately 132
°
C with 0 LFM
of air flow. If the target maximum junction temperature of the
AD8016ARB is 125
°
C, a 4-layer PCB with 1 oz. copper covering
the outer layers and measuring 9 square inches is required
with 0 LFM of air flow.
Note that the AD8016ARE is targeted at xDSL applications
other than full-rate CO ADSL. The AD8016ARE is targeted at
g.lite and other xDSL applications where reduced power dissi-
pation can be achieved through a reduction in output power.
Extreme temperatures associated with full-rate ADSL using the
AD8016ARE should be avoided whenever possible.
AIR FLOW
LFM
75
0
J
70
65
60
55
50
45
40
50
100
150
200
ARP 6 SQ-IN
ARP 4.7 SQ-IN
ARP 12 SQ-IN
ARB 4.7 SQ-IN
ARB 7.125 SQ-IN
ARB 9 SQ-IN
ARB 6 SQ-IN
ARP 9 SQ-IN
+24 C AMBIENT
Figure 42. Junction Temperature vs. Air Flow
PCB AREA
SQ-IN
35
4
J
30
25
20
15
10
7
10
ARB 0 LFM
ARB 50 LFM
ARB 100 LFM
ARB 200 LFM
ARB 150 LFM
ARP 0 LFM
ARP 100 LFM
ARP 200 LFM
ARP 150 LFM
ARP 50 LFM
Figure 43. Junction-to-Ambient Thermal Resistance vs.
PCB Area
40
0
35
30
2
4
10
25
20
15
6
8
10
1
3
5
7
9
50
45
PCB AREA
SQ-IN
J
ARE 0 LFM
ARE 200 LFM
ARE 400 LFM
Figure 44. Junction-to-Ambient Thermal Resistance vs.
PCB Area
相關(guān)PDF資料
PDF描述
AD8016ARE-EVAL Low Power, High Output Current xDSL Line Driver
AD8016ARE-REEL Low Power, High Output Current xDSL Line Driver
AD8016ARP-EVAL Low Power, High Output Current xDSL Line Driver
AD8016ARP-REEL Low Power, High Output Current xDSL Line Driver
AD8016 Low Power, High Output Current xDSL Line Driver
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