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參數資料
型號: OP484
廠商: Analog Devices, Inc.
英文描述: Precision Rail-to-Rail Input & Output Operational Amplifiers(精密滿幅度輸入輸出運放)
中文描述: 精密軌到軌輸入
文件頁數: 5/20頁
文件大?。?/td> 370K
代理商: OP484
REV. 0
–5–
OP184/OP284/OP484
ABSOLUT E MAX IMUM RAT INGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Differential Input Voltage
2
. . . . . . . . . . . . . . . . . . . . . .
±
0.6 V
Output Short-Circuit Duration to GND
3
. . . . . . . . . Indefinite
Storage T emperature Range
P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Operating T emperature Range
OP184/OP284/OP484E, F . . . . . . . . . . . . .–40
°
C to +125
°
C
Junction T emperature Range
P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Lead T emperature Range (Soldering 60 sec) . . . . . . . . +300
°
C
Package T ype
θ
JA3
θ
JC
Units
8-Pin Plastic DIP (P)
8-Pin SOIC (S)
14-Pin Plastic DIP (P)
14-Pin SOIC (S)
103
158
83
92
43
43
39
27
°
C/W
°
C/W
°
C/W
°
C/W
NOT ES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
For input voltages greater than 0.6 volts the input current should be limited to less
than 5 mA to prevent degradation or destruction of the input devices.
3
θ
is specified for the worst case conditions; i.e.,
θ
is specified for device in socket
for cerdip, and P-DIP packages,
θ
JA
is specified for device soldered in circuit board
for SOIC package.
ORDE RING GUIDE
T emperature
Range
Package
Description
Package
Option
Model
OP184EP
OP184ES
OP184FP
OP184FS
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
8-Pin Plastic DIP
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
N-8
SO-8
N-8
SO-8
OP284EP
OP284ES
OP284FP
OP284FS
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
8-Pin Plastic DIP
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
N-8
SO-8
N-8
SO-8
OP484EP
OP484ES
OP484FP
OP484FS
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
–40
°
C to +125
°
C
14-Pin Plastic DIP N-14
14-Pin SOIC
14-Pin Plastic DIP N-14
14-Pin SOIC
SO-14
SO-14
OP284 Die Size 0.065
×
0.092 Inch, 5,980 Sq. Mils
Substrate (Die Backside) Is Connected to V–.
Transistor Count, 62.
OP484 Die Size 0.080
×
0.110 Inch, 8,800 Sq. Mils
Substrate (Die Backside) Is Connected to V–.
Transistor Count, 120.
R3
Q1
–IN
+IN
QL1
QL2
Q4
Q3
Q2
QB5
QB6
RB2
QB3
R1
Q5
R2
QB4
JB2
QB1
CB1 N+
P+
M
QB2
CC1
Q9
Q7
Q11
Q8
Q6
Q10
Q12
QB7
QB8
QB9
RB1
JB1
TP
R4
R5
R6
RB3
C FF
R7
R8
Q13
Q14
R10
Q15
RB4
QB10
CC2
C O
Q17
Q16
R11
Q18
V
CC
OUT
V
EE
R9
Figure 1. Simplified Schematic
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